M. Baker, Stanford University, USA
J. Crowcroft, UCL, UK
A. Danthine, Universite de Liege, Belgium
P. Danzig, USC, USA
C. Diot, INRIA, France
P. Druschel, Rice University, USA
D. Estrin, USC, USA
S. Floyd, LBL, USA
P. Francis, NTT, Japan
J. J. Garcia-Luna-Aceves, UCSC, USA
R. Guerin, IBM, USA
M. Handley, ISI, USA
C. Huitema, Bellcore, USA
P. Humblet, Eurecom, France
S. Keshav, Cornell Univ., USA
J. Kurose, University of Massachusetts, USA
S. Lam, University of Texas, USA
W. Leland, Bellcore, USA
S. McCanne, U. C. Berkeley, USA
G. Neufeld, UBC, Canada
D. Oran, Cisco, USA
C. Partridge, BBN, USA
V. Paxson, LBL, USA
S. Pink, SICS, Sweden
D. Schmidt, Washington University, USA
S. Shenker, Xerox PARC, USA
K. Sollins, MIT, USA
J. Turner, Washington University, USA
M. Steenstrup, BBN, USA
G. Varghese, Washington University, USA
H. Zhang, CMU, USA
L. Zhang, UCLA, USA